Research

Dynamic thermomechanical analysis as a control technique for thermoset bonding of wood joints


Reference:

Onic, L., Bucur, V., Ansell, M. P., Pizzi, A., Deglise, X. and Merlin, A., 1998. Dynamic thermomechanical analysis as a control technique for thermoset bonding of wood joints. International Journal of Adhesion and Adhesives, 18 (2), pp. 89-94.

Related documents:

This repository does not currently have the full-text of this item.
You may be able to access a copy if URLs are provided below.

Official URL:

http://dx.doi.org/10.1016/S0143-7496(97)00049-3

Abstract

Dynamic thermomechanical analysis was used to control and investigate the viscoelastic behaviour, as expressed by the dynamic storage modulus and by tan δ, of wood joints bonded with crosslinking thermosetting adhesives. Phenol formaldehyde (PF), melamine-urea-formaldehyde (MUF), resorcinol-formaldehyde (RF), tannin-formaldehyde (TF) and tannin-hexamethylenetetramine (TH) were the resins used. The approach presented indicated that three parameters, defined as the stiffening coefficient, the softening coefficient and the degradation coefficient, may be of interest in comparing wood joints bonded with different adhesives

Details

Item Type Articles
CreatorsOnic, L., Bucur, V., Ansell, M. P., Pizzi, A., Deglise, X. and Merlin, A.
DOI10.1016/S0143-7496(97)00049-3
DepartmentsFaculty of Engineering & Design > Architecture & Civil Engineering
Faculty of Engineering & Design > Mechanical Engineering
RefereedYes
StatusPublished
ID Code13467

Export

Actions (login required)

View Item