Wafer-scale transfer of nanoimprinted patterns into silicon substrates
Reference:
Hubbard, G., Abbott, S. J., Chen, Q., Allsopp, D. W. E., Wang, W. N., Bowen, C. R., Stevens, R., Satka, A., Hasko, D., Uherek, F. and Kovac, J., 2009. Wafer-scale transfer of nanoimprinted patterns into silicon substrates. Physica E-Low-Dimensional Systems & Nanostructures, 41 (6), pp. 1118-1121.
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Official URL:
http://dx.doi.org/10.1016/j.physe.2008.08.014
Abstract
A simple low cost method of nanoimprinting has been developed. The technique uses a flexible disposable master and lends itself to roll-to-roll processing. Residual layer thicknesses of 5-10 nm are routinely achieved. This enables the critical step of pattern transfer into hard substrates by reactive ion etching, an essential step in the fabrication of sub-wavelength photonic device elements on a wafer-scale.
Details
| Item Type | Articles |
| Creators | Hubbard, G., Abbott, S. J., Chen, Q., Allsopp, D. W. E., Wang, W. N., Bowen, C. R., Stevens, R., Satka, A., Hasko, D., Uherek, F. and Kovac, J. |
| DOI | 10.1016/j.physe.2008.08.014 |
| Uncontrolled Keywords | silicon, pattern transfer, nanoimprinting |
| Departments | Faculty of Engineering & Design > Mechanical Engineering Faculty of Engineering & Design > Electronic & Electrical Engineering |
| Research Centres | Centre for Advanced Sensor Technologies (CAST) Materials Research Centre |
| Refereed | Yes |
| Status | Published |
| ID Code | 14710 |
| Additional Information | Proceedings paper from the Spring Meeting of the European-Materials-Research-Society on Frontiers in Silicon-Based Photonics. Strasbourg, France, 26-29 May, 2008 |
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