Integration of Individual Nanoscale Structures into Devices Using Dynamic Nanostenciling

Reference:

Egger, S., Ilie, A., Machida, S. and Nakayama, T., 2008. Integration of Individual Nanoscale Structures into Devices Using Dynamic Nanostenciling. In: 2nd IEEE International Nanoelectronics Conference, 2008. INEC 2008. IEE, 158 - 159.

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Official URL:

http://dx.doi.org/10.1109/INEC.2008.4585459

Abstract

We succeeded in integrating individual, pre-existing nanostructures into functional devices using ultrahigh vacuum dynamic nanostenciling. Nanostructures are first located via atomic force microscopy (AFM), while device elements are added step by step, with an achieved positional accuracy of 20 nm. Electronic transport, potentiometry, and scanning Kelvin probe can be used for control at any fabrication stage.

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