Research

Bonding strength properties of adhesively-timber joint with thixotropic and room temperature cured epoxy based adhesive reinforced with nano- and micro-particles


Reference:

Ahmad, Z., Ansell, M. P. and Smedley, D., 2011. Bonding strength properties of adhesively-timber joint with thixotropic and room temperature cured epoxy based adhesive reinforced with nano- and micro-particles. IOP Conference Series: Materials Science and Engineering, 17 (1), 012007.

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Official URL:

http://dx.doi.org/10.1088/1757-899X/17/1/012007

Abstract

This research work is concerned with in situ bonded-in timber connection using pultruded rod; where the manufacturing of such joint requires adhesive which can produce thick glue-lines and does not allow any use of pressure and heat. Four types of thixotropic (for ease application) and room temperature cured epoxy based were used namely CB10TSS (regarded as standards adhesive), Nanopox (modification of CB10TSS with addition of nanosilica), Albipox (modification of CB10TSS with addition of liquid rubber) and Timberset (an epoxy-based adhesive with addition of micro-size ceramic particles). The quality of the adhesive bonds was accessed using block shear test in accordance with ASTM D905. The bond strength depends on how good the adhesive wet the timber surface. Therefore the viscosity and contact angle was also measured. The nano- and microfiller additions increased the bond strength significantly. The viscosity correlates well with contact angle measurements where lower viscosities are associated with lower contact angles. However contact angle contradicts with measured strength and wettability.

Details

Item Type Articles
CreatorsAhmad, Z., Ansell, M. P. and Smedley, D.
DOI10.1088/1757-899X/17/1/012007
DepartmentsFaculty of Engineering & Design > Mechanical Engineering
RefereedYes
StatusPublished
ID Code23322
Additional InformationConference on Advanced Materials and Nanotechnology, CAMAN 2009. 3-5 November 2009. Kuala Lumpur, Malaysia.

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