New prototype assembly methods for biosensor integrated circuits
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Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.
|Creators||Graham, A. H. D., Bowen, C. R., Surguy, S. M., Robbins, J. and Taylor, J.|
|Uncontrolled Keywords||packaging,assembly,partial encapsulation,biosensor,prototype,integrated circuit|
|Departments||Faculty of Engineering & Design > Electronic & Electrical Engineering|
Faculty of Engineering & Design > Mechanical Engineering
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