New prototype assembly methods for biosensor integrated circuits
Reference:
Graham, A. H. D., Bowen, C. R., Surguy, S. M., Robbins, J. and Taylor, J., 2011. New prototype assembly methods for biosensor integrated circuits. Medical Engineering & Physics, 33 (8), pp. 973-979.
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Official URL:
http://dx.doi.org/10.1016/j.medengphy.2011.03.006
Abstract
Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.
Details
| Item Type | Articles |
| Creators | Graham, A. H. D., Bowen, C. R., Surguy, S. M., Robbins, J. and Taylor, J. |
| DOI | 10.1016/j.medengphy.2011.03.006 |
| Uncontrolled Keywords | packaging, assembly, partial encapsulation, biosensor, prototype, integrated circuit |
| Departments | Faculty of Engineering & Design > Electronic & Electrical Engineering Faculty of Engineering & Design > Mechanical Engineering |
| Refereed | Yes |
| Status | Published |
| ID Code | 24240 |
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