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New prototype assembly methods for biosensor integrated circuits


Reference:

Graham, A. H. D., Bowen, C. R., Surguy, S. M., Robbins, J. and Taylor, J., 2011. New prototype assembly methods for biosensor integrated circuits. Medical Engineering & Physics, 33 (8), pp. 973-979.

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Official URL:

http://dx.doi.org/10.1016/j.medengphy.2011.03.006

Abstract

Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.

Details

Item Type Articles
CreatorsGraham, A. H. D., Bowen, C. R., Surguy, S. M., Robbins, J. and Taylor, J.
DOI10.1016/j.medengphy.2011.03.006
Uncontrolled Keywordspackaging, assembly, partial encapsulation, biosensor, prototype, integrated circuit
DepartmentsFaculty of Engineering & Design > Electronic & Electrical Engineering
Faculty of Engineering & Design > Mechanical Engineering
RefereedYes
StatusPublished
ID Code24240

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