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The relationship between the arrangement of wood strands at the surface of OSB and the modulus of rupture determined by image analysis


Reference:

Nishimura, T., Ansell, M. P. and Ando, N., 2001. The relationship between the arrangement of wood strands at the surface of OSB and the modulus of rupture determined by image analysis. Wood Science and Technology, 35 (6), pp. 555-562.

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Abstract

The objective of this paper is to investigate the relationship between the arrangement of wood strands at the surface of oriented strand board (OSB) and the modulus of rupture (MOR) determined by applying the technique of image analysis (IA). Fiber orientation was measured manually. In addition a CCD (charge coupled device) digital camera was used to automatically measure the fiber orientation at the surface of OSB. The total number of OSB samples evaluated was equal to 55, but variation in density was small and the coefficient of variation was only 4%. In contrast, the variation in MOR is wide and the coefficient of variation is 17%. Thus, the variation in density of OSB does not reflect variations in MOR. The relationship between the MOR and the average angle of fiber orientation resulted in a weak negative correlation (r = -0.44) as might be expected, as better axial orientation should improve MOR. The average strand area gave no correlation with MOR. Clearly, large strands which should enhance MOR may be heavily disoriented, whereas small strands which have less influence on the MOR might be well oriented. Hence no correlation between MOR and average strand area is observed. The prediction of MOR by using a multiple linear regression equation including density and fiber orientation factors is only moderately successful. Hence another factor must be identified to predict MOR accurately. The CCD camera measures fiber orientation at the OSB surface effectively.

Details

Item Type Articles
CreatorsNishimura, T., Ansell, M. P. and Ando, N.
DepartmentsFaculty of Engineering & Design > Mechanical Engineering
RefereedYes
StatusPublished
ID Code2821
Additional InformationID number: ISI:000173020200007

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